Mechanical Hardware Architect, Consumer Notebook

Location(s):
Taipei City, Taipei City, Taiwan
No additional locations
Category: Engineering
Job ID: 3069572
Posted: 1/26/2021 8:00:00 AM

HP is the world’s leading personal systems and printing company, we create technology that makes life better for everyone, everywhere. Our innovation springs from a team of individuals, each collaborating and contributing their own perspectives, knowledge, and experience to advance the way the world works and lives.

We are looking for visionaries, like you, who are ready to make a purposeful impact on the way the world works.

At HP, the future is yours to create!

If you are our Mechanical Architect, Consumer Notebook in Taiwan, you will have a chance to:

  • Works with internal cross functional team members including HW, ID, and product management to design new products and form factors
  • Leads multiple project teams of mechanical hardware engineers from outsourced development partners responsible for all stages of mechanical and thermal development for complex products and platforms, including solution design, validation, tooling and testing.
  • Manages and expands relationships with internal and outsourced development partners on mechanical and thermal design and development.
  • Reviews and evaluates designs and project activities for compliance with technology and development guidelines and standards; provides tangible feedback to improve product quality.
  • Provides domain-specific expertise and overall mechanical/thermal leadership and perspective to cross-organization projects, programs, and activities.
  • Drives innovation and integration of new technologies into projects and activities in the mechanical and thermal design organization.
  • Provides guidance and mentoring to less- experienced staff members.

Are you a high-performer? We are looking for an individual with:

  • Bachelor's or Master's degree in Mechanical Engineering.
  • Typically 10+ years experience.
  • Using ProEngineer or other 3D CAD software as a mechanical design tool.
  • Excellent analytical and problem solving skills.
  • Experience in mechanical and thermal architecture of NB systems.
  • Designing CNC, diecast, stamping, and plastic parts and associated production tooling and processes.
  • Using CFD and thermal mockups to validate thermal solution.
  • Excellent written and verbal communication skills; mastery in English and mandarin Chinese language.
  • Ability to effectively communicate product architectures, design proposals and negotiate options at senior management levels.

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HP is committed to working with and providing reasonable accommodation to qualified individuals with physical and mental disabilities. If you need assistance in filling out the employment application or require a reasonable accommodation while seeking employment, please e-mail usaccomodation@hp.com. Note: This option is reserved for applicants needing a reasonable accommodation related to a disability.

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